Packaging technology is a key feature of the luminous efficiency of LED light sources

With the increasing demand for component output in LED lighting applications, traditional LED packages not only limit component specification, but also disadvantageous heat dissipation. Novel unpackaged LEDs have better heat dissipation conditions, while integrating epitaxial, die and package processes. Conveniently paired with secondary optics to design lighting fixtures...

LED light source applications will gradually shift to LED general lighting applications after the peak demand for LCD backlight applications. However, unlike the LCD backlight module design, the LCD backlight module does not need to consider the optical and lighting application conditions, and the luminous efficiency requirements of the unit module are the main requirements; however, in addition to the brightness requirements, the LED lighting application must additionally consider the optical type, heat dissipation, Whether it is conducive to the secondary optical design, and the requirements of the design and configuration of the luminaire , the requirements for the LED light source components are actually higher.

More and more packaging technologies used in integrated circuits are also being used in the fabrication of LED light source devices.

LED components that can be surface-bonded for a large number of processing and production, increasing production and processing efficiency

Early packaging technology limits many thermal issues affecting high-brightness design development

Early LED light source components, packaging materials mainly used in the shell-type package, in the early days of high-efficiency blue LEDs are quite common, and in the promotion of the thin design requirements of smart phones and mobile phone products, the use of surface-mount devices (surface-mount devices; The demand for LED light sources of SMD type is increasing, and the LED light source components designed by surface adhesion technology can accelerate the production processing efficiency by using the tape-type tape loading material, and increase the processing efficiency through automated production, and also bring LEDs. The new application market of packaging technology, coupled with the subsequent advancement of epitaxial structure and packaging technology, and the mutual improvement of LED light source materials can gradually surpass the performance of traditional lamps.